Failure Analysis Engineer - Nanoprobing (2nd Shift)

This role includes an initial training period of approximately 8–10 months conducted on first shift.

Upon successful completion of training, the position is expected to transition to second-shift hours as part of ongoing role requirements.

We are seeking a highly skilled and motivated Failure Analysis Engineer to join our dynamic team.

The primary responsibility of this role is the electrical characterization of semiconductor IC devices using advanced nanoprobe systems.

The successful candidate will evaluate the electrical characteristics of systems, integrated circuits, components, and sub-components to determine the root cause of failures using nanoprobing and physical failure analysis tools and techniques.

• Conduct electrical characterization of semiconductor IC devices using nanoprobe systems.
• Evaluate electrical characteristics to determine root cause of failures.
• Collaborate with Product Engineering, Design Engineering, Quality Engineering, and Foundry Engineering teams.
• Analyze design, reliability, or yield failures down to the root cause.
• Utilize various state-of-the-art analytical tools and process acquired data to arrive at conclusions.
• Work autonomously or within a team to troubleshoot and resolve technical issues.
• Communicate effectively with cross-functional teams globally.
• Provide technical training and support to clients on nanoprobing and failure analysis techniques.
• Maintain accurate records of experiments, data, and findings.
• Ensure compliance with company and industry safety standards.
• Stay updated on industry advancements and new technologies related to nanoprobing and failure analysis.
• Participate in conferences and meetings to share expertise and knowledge.

• Hands-on experience in Nanoprobe Analysis
• Sound theoretical knowledge of Digital/Analog CMOS circuits.
• Experience with CAD layout tools. Ability to analyze layout and convert to basic schematics.
• Understanding of circuit function and relation to failure signatures.
• Excellent data analysis and problem-solving skills.
• Strong interpersonal skills and ability to work effectively within a cross-functional team environment.
• Hands-on experience in semiconductor IC Failure Analysis, including structural debug (ATPG) for yield and fault isolation techniques is a plus.

• Required: Bachelor's degree in Electrical Engineering or Electronics and Communications.
• Preferred: Master's degree in Electrical Engineering.

Us: At QTI, you will have the opportunity to work with cutting-edge technology and collaborate with a team of talented engineers and scientists.

We offer a stimulating work environment where innovation and creativity are encouraged.

Join us and be part of a team that is shaping the future of semiconductor analysis.

Qualcomm is an equal opportunity employer.

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You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here .

Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.

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Pay range and Other Compensation & Benefits :

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted.

Even more importantly, please note that salary is only one component of total compensation at Qualcomm.

We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).

In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .

If you would like more information about this role, please contact Qualcomm Careers .