Senior Process Engineer – Electroless Copper

Job/Position Summary The Senior Process Engineer – Electroless Copper is responsible for the development, optimization, qualification, and control of electroless copper deposition processes used in glass panel semiconductor manufacturing.

The role focuses on achieving robust metallization performance, uniform copper deposition, excellent adhesion, defect reduction, and stable process control for advanced packaging applications.

This position plays a critical role in enabling reliable seed layer formation and metallization technologies for glass substrate integration and next-generation panel-level packaging.

Primary Responsibilities Develop and optimize electroless copper deposition processes for glass substrates, TGV metallization, seed layer formation, and panel-level packaging applications.

Define and control critical process parameters, including bath composition, pH, temperature, agitation, loading factor, deposition rate, and replenishment strategy.

Own and improve electroless copper process performance with focus on deposition uniformity, adhesion enhancement, defect reduction, and process stability.

Lead root cause analysis and corrective actions for plating defects, including voids, skip plating, blistering, peeling, oxidation, roughness, and contamination-related failures.

Drive process qualification, DOE execution, and recipe optimization for new tools, chemistries, additives, and substrate materials.

Work closely with wet chemistry and analytical teams to ensure bath stability, contamination control, additive management, and process consistency.

Develop and maintain SOPs, process specifications, OCAPs, bath control plans, and process documentation for manufacturing operations.

Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, throughput enhancement, and process robustness.

Ensure compliance with EHS and chemical safety requirements while driving continuous improvement in chemical usage, bath life, copper utilization efficiency, and manufacturing cost reduction.

Own equipment process qualification activities, including SAT, installation, operational, and performance qualifications, process acceptance, and production release for DFR developer and stripper tools.

Collaborate with equipment engineering teams to improve plating tool capability, chemical delivery systems, filtration efficiency, and equipment reliability.