Reliability & Yield Engineering Manager

• Support process integration and product qualification for new substrate technologies, including glass substrates with TGV, ABF/polyimide build-up, fine-line RDL, ENEPIG or other surface finishes, and advanced packaging substrates.
• Work with design, process, test, and quality teams to define product-specific reliability requirements and acceptance criteria.
• Support transition from engineering lots to pilot production and high-volume manufacturing.

• Bachelor’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or related field. Advanced degree preferred.
• 8+ years of experience in semiconductor packaging.
• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements.

include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

• A strong understanding of advanced substrate fabrication, glass or organic core substrates, copper plating and via metallization, RDL and fine-line lithography, surface finish processes, package-level reliability testing, and failure analysis.
• Experience with reliability standards and test methods such as JEDEC, IPC, AEC-Q, or customer-specific qualification requirements.
• Strong statistical analysis skills, including SPC, DOE, Cp/Cpk, GR&R, yield modeling, and data-driven root cause analysis. Must have strong analytical skills and be proficient in JMP analysis.
• Experience preparing customer-facing reliability reports, qualification documents, 8D reports, and corrective action plans.
• Experience with glass substrates, through-glass vias, TGV metallization, RF substrates, chiplet substrates, AI/HPC substrates, or advanced interposers is preferred.
• Hands-on knowledge of analytical tools such as SEM/EDS, FIB, X-ray, SAM, ion chromatography, profilometry, metrology, electrical test, and cross-section analysis is preferred.
• Experience ramping a new fab, pilot line, or advanced packaging manufacturing process is preferred.
• Familiarity with customer qualification for aerospace, defense, telecom, automotive, AI/HPC, or high-reliability electronics markets is preferred.

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.