Copper Plating Engineering Group Leader

include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

• Demonstrated experience leading technical teams or serving as a senior technical authority.
• Proven track record of solving complex plating and integration challenges.
• Experience with plating equipment operation, optimization, and qualification.
• Experience with plating chemistry additives, including suppressors, accelerators, and levelers.
• Knowledge of wafer-level and/or panel-level plating process development and manufacturing.
• Knowledge of microvia electroplating and void-free fill techniques.
• Knowledge of plating seed layer etching and related metallization removal processes.
• Experience in through Glass Via (TGV) filling.
• Familiarity with high-volume manufacturing requirements and process control methodologies.
• Ability to balance technical depth with project and people leadership.
• Excellent communication and mentoring skills.
• Supplier and equipment vendor engagement experience.
• Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments.
• Experience in through Silicon Via (TSV) filling.
• Knowledge of photoresist stripping and post-plating cleaning processes.
• Experience with redistribution Layer (RDL) electroplating.
• Knowledge of electroless copper plating chemistries, including copper seed layer formation.
• Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating.
• Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions.
• Strong experimental design and data analysis skills.

• Must be able to wear personal protective gear most of the day (where applicable).
• Prolonged periods of sitting or standing.

• Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
• A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
• The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.