Copper Plating Engineer

The Copper Plating Engineer will develop, optimize, and support copper electroplating and electroless plating processes.

This role is ideal for an engineer who enjoys working directly with tools and chemistries, running experiments, solving problems quickly, and contributing across R&D and early manufacturing environments.

• Develop and optimize ABF and DFR lamination processes for advanced packaging applications.
• Run experiments to improve lamination quality, adhesion, and yield.
• Support DFR exposure and development processes and chemistry control.
• Troubleshoot adhesion loss, voiding, wrinkling, delamination, warpage, and defectivity.
• Develop and maintain ABF/DFR adhesion to glass and copper surfaces.
• Support ABF laser structuring and via formation processes.
• Set up, qualify, and maintain ABF/DFR lamination and exposure equipment.
• Work closely with integration, laser, plating, and reliability teams.
• Collect and analyze process data; apply DOE and root cause analysis to drive improvements.
• Support scale-up from R&D to pilot and early manufacturing environments.
• Perform additional functions and other duties as assigned or required.

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, or related field required.
• 2-5 years of experience in copper plating or advanced packaging process engineering.
• Panel-level plating experience is desired.
• An advanced packaging or heterogeneous integration background is desired.
• Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
• This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements.