Electroplate Engineering Manager

The Electroplate Team Leader must provide technical expertise around back-end thick Cu (Bump) integration.

Knowledge of photolithography, electroplating, spin-on dielectrics, as well as laminate films is a must.

This individual must be able to lead teams and have excellent project management skills.

Knowledge and experience of moving from R&D to high volume manufacturing in semiconductor manufacturing would put this individual above other candidates.

This individual will have full visibility to the entire executive management team, with the ability to advance as the company expands and grows.

• Provide technical expertise in electroplating. Lead R&D efforts to further expand current capability.
• Provide and lead efforts for dicing, etch, and solder ball attach.
• Provide support related to manufacturing continuous improvement efforts.
• Evaluate and improve manufacturing processes and manufacturing systems through disciplined problem-solving methodology and design of experiments.
• Maintain reliable and safe manufacturing systems while improving quality, yields, production rates, efficiencies, and reducing costs.
• Develop innovative solutions and incorporate new methods and processes to improve existing operations.
• Work with external companies and universities to continue R&D efforts on the latest integration improvements.
• Inspect materials, products, or equipment to detect defects or malfunctions in an effort to drive improvements.
• Determine root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods.

• Bachelor of Science in Engineering.
• 10+ years of experience in a semiconductor manufacturing environment. Must have knowledge of thick Cu (bump) manufacturing integration.