Product Engineer, Product Operations Engineer

• Own assigned products across the full lifecycle: new product introduction (NPI), characterization, qualification, ramp, and sustaining
• Drive yield analysis and improvement—monitor wafer sort and final test yield, lead failure analysis and root-cause efforts, and partner with design/test to close gaps
• Own the multi-die yield story—known-good-die (KGD) sorting, die-matching and binning across a package, assembly and packaging yield, and cost-per-package risk (a single marginal die can sink an entire multi-die assembly)
• Manage test program quality and optimization across wafer sort, final test, and system-level test (SLT)—test time reduction, coverage vs. cost trade-offs, guardbands, and outlier/screening strategies (PAT/SBL/SYL) used to screen marginal die for KGD
• Lead silicon characterization across PVT corners; define spec limits, shmoo analysis, and datasheet correlation
• Own product qualification (HTOL, HAST, TC, ESD/latch-up, etc.) and reliability sign-off in line with JEDEC standards as applicable
• Establish and drive production operations: lot dispositioning, capacity and WIP management, binning/grading strategy, and coordination with foundry and OSAT (assembly/test) partners
• Monitor and act on production data—SPC, yield dashboards, and statistical analysis (JMP/Python) to detect excursions and drive corrective action
• Lead excursion management and 8D/CAPA—contain, root-cause, and resolve manufacturing and quality issues; establish customer-return (RMA/FA) handling
• Drive cost reduction and continuous improvement—test time, yield, package, and material cost initiatives
• Help establish customer-quality processes—field issue resolution, quality reporting, and audits

What we're looking for:

• Bachelor's or Master's in Electrical Engineering, Materials/Semiconductor Engineering, or related field
• Hands-on experience in semiconductor product engineering, test engineering, or operations for complex digital/SoC/ASIC products
• Strong understanding of the semiconductor manufacturing flow—wafer fab, wafer sort, assembly, and final test
• Multi-die / advanced-package product engineering—known-good-die (KGD) sorting, die-to-package matching and binning, assembly and packaging yield, and cost-per-package management
• Experience with foundry and OSAT relationships and offshore test/assembly operations