Hardware Test Engineer

• Develop and run package-level test — socket-based bring-up and validation of packaged units: power-up, interface/interconnect continuity, and functional/parametric checks against spec (board↔package interface, not ATE silicon device test)
• Develop and run board-level test — functional, structural (boundary scan/JTAG), in-circuit, and bring-up validation for accelerator boards and system hardware
• Build out system-level test — bring up and validate assembled accelerator systems against spec, including functional, stress, and burn-in flows
• Design and validate test hardware and fixtures — sockets, connectors, load boards, and board/system fixtures for high-speed and high-current test
• Drive test coverage, yield analysis, and test-time/cost reduction across the product lifecycle
• Lead new-product test bring-up; resolve test escapes, yield excursions, and hardware failures with data-driven root cause
• Run characterization and correlation across levels — package ↔ board ↔ system, and bench ↔ production test
• Define test specs, limits, and guardbands with design, product, packaging, and reliability engineering
• Transfer and sustain test programs at OSAT/CM and manufacturing partners through ramp to high volume
• Use and develop AI-assisted tool flows to accelerate test development, debug, and yield analysis

What we're looking for

• BS/MS in Electrical/Computer Engineering or equivalent plus 5+ years in package/board/system-level hardware test engineering
• Hands-on test experience across at least two of package-level, board-level, and system-level test — with the ability to own the others
• Package and board test hardware experience (sockets, connectors, load boards, fixtures) and the signal/power integrity that comes with high-speed, high-current test
• Lab bring-up and debug skills: oscilloscopes, logic and protocol analyzers, power and thermal instrumentation
• Data analysis and statistical skills for yield, characterization, and correlation work
• (Optional) High-speed I/O / SerDes, DDR/HBM, RF, or high-current/power-device test; structural test (boundary scan); scripting/automation (Python, C++); system burn-in and reliability test; OSAT/CM partner management