Staff Process Engineer, Advanced Packaging CMP

• BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with 5+ years of experience in Chemical Mechanical Planarization (CMP) within the semiconductor industry
• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
• Experience in dielectrics/metals CMP process development on Advanced Packaging or other semiconductor technologies
• Understanding of various integration/structural impacts and constraints related to film deposition and other upstream/downstream processes
• Excellent oral and written communication skills with ability to convey messaging and technical concepts in concise and effective manners

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics plus 3+ years of relevant experience
• Skills in data science, modelling, and experience/an interest in leveraging AI to optimize workflows
• A specialized background in 300mm wafer fabrication

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