Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE)

Education ∙ Masters or PhD degree in Electrical Engineering, Computer Engineering, or related field required Experience ∙ 5+ years of experience in die design and physical layout engineering ∙ Direct hands-on experience with HBM, 3D-IC, or advanced packaging programs (CoWoS, SoIC, FOVEROS, or equivalent) ∙ Proven experience with TSV-based die design including KOZ management, micro-bump layout, and backside RDL

Technical Skills ∙ Deep expertise in physical design and layout using industry-standard EDA tools (Cadence Virtuoso, Innovus, Mentor Calibre, Synopsys IC Compiler) ∙ Strong knowledge of DRC/LVS/ERC sign-off flows and foundry PDK rule interpretation ∙ Solid understanding of TSV design rules, stress modeling implications, and 3D integration layout constraints ∙ Working knowledge of DFT structures relevant to advanced packaging: daisy chains, BIST, boundary scan, IEEE P1838 ∙ Familiarity with JEDEC HBM specifications (HBM2E, HBM3, HBM3E) ∙ Understanding of power integrity, signal integrity, and thermal considerations at the die-package interface ∙ Experience with parasitic extraction and layout-driven optimization for high-speed memory interfaces Preferred Qualifications

∙ Experience with hybrid bonding or direct bond interconnect (DBI) die design constraints ∙ Familiarity with chiplet architecture and disaggregated die design for heterogeneous integration ∙ Knowledge of HBM assembly (TCB, underfill, wafer thinning) ∙ Experience with layout automation scripting (Skill, Python, Tcl) for template generation and DRC waiver management ∙ Exposure to reliability physics relevant to advanced packaging: electromigration, stress voiding, thermo-mechanical degradation ∙ Published work or patents in advanced packaging, 3D-IC design, or memory interface design

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About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.

With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.

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