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At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.
When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world.
Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.
Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.
The Optical Product Packaging & Design team, based in Edinburgh and Singapore, is part of ST’s wider Imaging & Custom subgroup. The team designs and develops precision opto-mechanical assemblies incorporating ST silicon sensors to deliver advanced optical and photonic products.
As a Thermal-Mechanical Simulation Engineer, you will work closely with the R&D project team to develop products that meet performance, manufacturability, and cost objectives. Using advanced simulation tools, you will perform finite element analysis (FEA), computational fluid dynamics (CFD), and multiphysics studies to identify potential issues early in the development process and to recommend design improvements that enhance product performance and robustness.
You will also use analysis tools to support failure investigation and root cause analysis. In this role, you will collaborate with package design engineers, optical engineers, substrate designers, and core team members to ensure that proposed improvements are properly verified and implemented.
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This position requires regular interaction with stakeholders across multiple geographic locations. The successful candidate must be comfortable working across different time zones and travelling at short notice where required.
Bachelor’s, Master’s, or PhD in Mechanical Engineering, with relevant undergraduate modules
Strong knowledge of material science
Good understanding of solid mechanics, including static and dynamic behaviour
Sound knowledge of thermal engineering and heat transfer
Minimum 5 years of relevant experience
Experience in mold flow analysis
Experience in collaborative design environments
Familiarity with FMEA
CAD proficiency in SolidWorks
Understanding of product design processes
Strong documentation and presentation skills
ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.
At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.
To discover more, visit st.com/careers.
Global semiconductor manufacturer of microchips and integrated circuits.
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Senior · 5+ years experience
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