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Senior Mechanical Packaging Engineer
Nokia
USA
Full-time
Senior · 5–8 years experience
Hybrid
Discovered 2 weeks ago
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About the Role
At Nokia, we're on a mission to revolutionize global network capacity, bringing faster and more accessible connectivity to everyone. Our Network Infrastructure (NI) group is at the heart of this revolution, fueled by ambition, innovation, and technical expertise. Within NI, the Advanced Optics (AO) team designs cutting-edge optical modules using silicon photonics and advanced packaging for high-performance coherent communication. The Advanced Packaging team within AO focuses on the intricate details of package design and processes, ensuring seamless integration from wafer-scale to component-level packaging. As a Packaging Development Engineer, you'll be a key player in developing the next generation of high-performance electro-optic modules, integrating silicon photonics-based coherent optical transceivers into Nokia's Photonic Service Engines, from initial concept to product launch. Join us and be a part of this exciting journey!
Key Skills for This Role
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Responsibilities
- Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
- Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets.
- Drive key technology development to enable next generation product design.
- Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software.
- Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses.
- Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products.
- Plan and Drive prototype assembly builds to enable deliveries for early design validation.
- Drive package debug activities during product validation and qualification.
- Survey new materials and vendors for all Advanced Packaging activities.
- Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
- - Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. - Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. - Drive key technology development to enable next generation product design. - Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. - Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses. - Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products. - Plan and Drive prototype assembly builds to enable deliveries for early design validation. - Drive package debug activities during product validation and qualification. - Survey new materials and vendors for all Advanced Packaging activities. - Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
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