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PIC Process Integration Engineer
Nokia
USA
Full-time
Mid
Discovered 2 weeks ago
python
Free
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About the Role
The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team.
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Responsibilities
- Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones.
- Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow.
- Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology.
- Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets.
- Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.
- Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones. Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow. Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology. Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets. Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.
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