Packaging Engineer- Materials

• Strong experience in wafer level molding and underfill processes for advanced semiconductor

packages including fan-out wafer level packaging (FOWLP), 2.5D, and chiplet architectures.

• Deep understanding of mold compound and underfill material science including epoxy resin

systems, filler particle size and loading, cure chemistry, and how material properties drive

thermo-mechanical package behavior.

• Experience with underfill dispense techniques (capillary, no-flow, mold underfill), flow and void

characterization, bleed-out control, and cure process optimization including staged and snap

cure profiles.

• Understanding of thermo-mechanical behavior driven by mold and underfill materials including

CTE mismatch, warpage evolution through cure and reflow, delamination driving forces, and

material-induced reliability risks.

• Hands-on experience with failure analysis of mold and underfill failures including cross-sections,

SEM/EDS, CSAM, TGA, DSC, and DMA for material characterization and thermal cycling reliability

evaluation.

• Ability to work with OSATs and material suppliers to develop, qualify, and transfer mold and

underfill processes into production, including equipment setup and process control plans.

• Strong problem-solving skills with ability to debug mold and underfill yield and reliability issues in

manufacturing environments, including DOE-driven process optimization.

• Experience underfill materials for III-V or photonics packaging including optically clear

encapsulants and low-modulus underfills.

• Experience with mold and underfill integration in advanced packaging architectures including

2.5D interposers, 3D stacking, chiplet assemblies, and CoWoS-like structures where material

interactions and warpage are critical constraints.

• Familiarity with a broad bill of materials for advanced packaging encapsulation including clear

adhesives and underfills for photonics, high-filler, low-CTE mold compounds for 2.5D interposer

assemblies.

• Experience developing mold and underfill solutions for high-power or high-TDP devices where

material thermal conductivity, warpage stability, and coefficient of thermal expansion are tightly

constrained.

• Exposure to thermo-mechanical modeling or collaboration with simulation teams for warpage

prediction, delamination risk assessment, and material property sensitivity analysis for mold and

underfill optimization.

• Understanding of system-level interactions (TIM application and cold plate interaction with wafer

level molded wafer).