Advanced Packaging Engineer

You will contribute to and own aspects of the Volantis A-0 and A-1 package.

We are interested in both people with package design as well as package process development backgrounds

Our end goal has challenges to overcome in warpage, CTE mismatch, thermomechanical aspects, assembly speed and more.

We're building a wafer-scale package with both silicon and compound semiconductor dies sitting together at very high TDP.

This creates both unique challenges and opportunities.

The end result is breaking the memory wall, enabling a new era of AI, and a platform that scales another 1-3 orders of magnitude.

• Ability to think from first principles about novel problems- not just applying existing solutions outside of their range of application. What works for 5x reticle platforms may not work for 56x reticle platforms
• What works for 5x reticle platforms may not work for 56x reticle platforms
• Design or process development of complex packages

Nice to Have:

• Experience with heterogeneous material assemblies
• Experience with high-TDP packages
• Experience with compound semiconductor assemblies
• Experience with co-packaged optics
• Ability to work with architects to co-design system architecture and package design