MTS DRAM ASIC Architect

• BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or related discipline with 5+ years of experience in semiconductor architecture, design, or system engineering.
• Experience in one or more of the following areas: DRAM architecture, memory subsystem architecture, ASIC/SoC architecture.
• Good understanding of DRAM architecture including command flows, timing behavior, bank architecture, refresh management, row hammer mitigation, reliability features, and memory subsystem operation.
• Exposure to high-speed I/O, PHY architectures, clocking systems, SI/PI considerations, power delivery, thermal design, and/or die-to-die interfaces.
• Demonstrated ability to lead cross-functional technical discussions, develop architectural proposals, and drive tradeoff-based decision making.
• Strong analytical and problem-solving skills.
• Ability to drive architecture tradeoff studies across multiple engineering disciplines.
• Excellent written and verbal communication skills.

• Experience with DDR5/DDR6, LPDDR5/LPDDR6, HBM, GDDR, or emerging memory technologies with strong understanding of memory protocols, timing architectures, memory training, calibration, and PHY design.
• Experience evaluating architectural tradeoffs across DRAM die, logic die, advanced packaging, and system-level implementations.
• Experience with die-to-die interconnect technologies including TSV-based architectures, hybrid bonding, 2.5D/3D packaging, stacked-die systems, and advanced memory integration.
• Strong knowledge of CMOS technologies, semiconductor device fundamentals, analog/mixed-signal circuit concepts, and memory interface design.
• Understanding of SI/PI, clocking, power delivery, thermal considerations, and heterogeneous integration challenges.
• Experience working with industry standards organizations, customers, or ecosystem partners related to memory technologies.
• Experience with HBM base die architectures, embedded controllers, advanced memory system features, RAS, security, or logic-die-based memory products.
• Proven ability to leverage AI‐assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies
• Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all.

With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.

Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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