Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
Drive mechanical and electrical test vehicle design and development when necessary.
Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.
Minimum Qualifications:
BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
Exceptional verbal and written communication skills, with the ability to articulate technical strategies.
Preferred Qualifications:
Master’s degree or PhD in Electrical Engineering, Materials Science, or related field.
10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable.
Benefits:
Top Tier health insurance at no employee cost
Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
401k Matching
Flexible Spending Account (FSA) for Health Care & Dependent Care
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Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process.
Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
E-Verify Participation Poster (Bilingual English & Spanish)
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About SK hynix America
Technology
US subsidiary of SK hynix, one of the world's largest semiconductor manufacturers producing DRAM, NAND flash memory, and next-generation HBM chips for AI and data center applications.