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We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America.
You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions.
You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions
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San Jose, USA
, CAN
, CAN
, IND
, CAN
, CAN
, CAN
, CAN
US subsidiary of SK hynix, one of the world's largest semiconductor manufacturers producing DRAM, NAND flash memory, and next-generation HBM chips for AI and data center applications.
Visit company websiteJobs and hiring trendsMid · 5+ years experience
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