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As the founding technical lead, this expert will spearhead the HW/SW co-design of next-generation HBF–xPU systems, translating complex AI workload traces into precise architectural policies for caching, prefetching, and data movement.
The role demands deep hands-on expertise in memory controllers and performance modeling to define interface contracts and optimize system-level efficiency across the hardware and software stack.
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US subsidiary of SK hynix, one of the world's largest semiconductor manufacturers producing DRAM, NAND flash memory, and next-generation HBM chips for AI and data center applications.
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