SoC HW Systems Engineer — Packaging & IO

· Experience reviewing package roadmaps and translating customer system constraints into chip-level package and ballout requirements.

· Hands-on experience with signal integrity simulation at package level and model-based PHY/PMIC compatibility verification.

· Contributed to ballout map creation, reviewed platform ballout with stakeholders, and managed feedback cycles with package vendors.

· Worked on datasheet electrical parameter content for IO and system-level interface specifications.

· Experience driving BOM analysis for the full system solution around the microcontroller.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.