greenhouse
Senior Staff / Principal SOC Floorplan Lead
EnCharge AI
Bengaluru, IND
Full-time
Senior · 12+ years experience
Onsite
Discovered 3 weeks ago
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- Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below).
- Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA.
- Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery.
- Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions.
- Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop.
- Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion.
- Methodology Development: Build and maintain scalable Floorplanning workflows and scripts (Tcl, Python) tailored for a lean, fast-moving start-up team.
- Experience: 12 + years of hands-on experience in Physical Design SoC Floor planning preferably in Datacenter domain , with at least 3 years acting as a lead or primary owner of SoC-level Floorplanning.
- Domain Expertise: Proven track record of taping out large, complex chips—specifically for Data Center, Networking, or AI/Machine Learning applications.
- Start-Up Mentality: Highly driven, self-motivated, and comfortable with ambiguity. You take extreme ownership of your domain, pivot quickly when needed, and roll up your sleeves to get things done.
- Technical Depth:
- Deep understanding of how RTL structures and architectural decisions impact physical design PPA.
- Extensive experience with bump planning, flip-chip package requirements, and die-to-package co-optimization.
- Strong knowledge of analog/mixed-signal IP integration, shielding, and custom routing constraints.
- Expertise with industry-standard physical design tools ( Cadence Innovus).
- Education: BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
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