Design the analogue high-speed signal path from the drive electronics to the optical source, including driver circuitry, biasing, high-speed serial interfacing, and impedance matching.
Evaluate, select, and qualify high-speed driver components against the relevant interface, bandwidth, and drive requirements.
Design controlled-impedance, differential RF/microwave PCBs, managing trace geometry, return paths, via structures, and launch design.
Own signal integrity across the full electrical path, minimising packaging and interconnect parasitics that limit achievable data rate.
Design and characterise the optical receive chain, including photodetector and TIA, with layout optimised for low noise and sensitivity.
Apply and tune transmit and receive equalisation to extend usable bandwidth.
Carry out S-parameter measurement, eye-diagram and jitter analysis, and high-speed probing to separate intrinsic device performance from packaging effects.
Build and maintain RF link budgets, and translate findings into structured feedback for the device and photonics teams.
Where experience allows, contribute to the wider electronic design — schematic capture, PCB layout, power and voltage-regulator design, and FPGA integration and bring-up while the team grows.
Document results and contribute to the characterisation data that drives design iteration.
Skills, Knowledge and Expertise
Degree (BEng/MEng) or PhD in Electronic Engineering, RF/Microwave Engineering, Physics, or a related field, with substantial relevant experience at senior level (typically 6+ years).
Proven RF/microwave PCB design: controlled impedance, differential pairs, via management, and launch design at high frequencies.
High-speed serial interfaces, including AC coupling and biasing for high-speed signal paths.
Evaluating and qualifying high-speed driver and amplifier components.
S-parameter (VNA) measurement, calibration, and high-speed probing.
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Signal-integrity simulation (for example HyperLynx, Ansys SI, ADS, or similar).
Strong analytical and problem-solving skills, and the discipline to work to a measured link budget.
Broader schematic capture and board design using eCAD tools such as Altium, across digital and mixed-signal designs beyond the RF path.
Power electronics and voltage-regulator design (linear and switching), and power-integrity analysis.
FPGA circuit-level integration and bring-up.
Board-level architecture and full-lifecycle electronic design — architect, design, implement, and verify.
Digital video interfacing (for example HDMI) or comparable high-bandwidth digital protocols.
Photodetector / TIA receive-chain design and an understanding of high-speed eye-margin trade-offs.
Hardware bring-up, verification, and characterisation across mixed-signal designs.
A proven track record of delivering high-speed electronics into production.
Benefits
Pension scheme
Private medical & dental insurance
28 days’ holiday + bank holidays
Relocation support
Visa support available
About Plessey Semiconductors
Semiconductors249 employeesFounded 2010
UK private semiconductor manufacturer designing and producing photonic devices, microLED displays, and optical computing hardware for technology customers.