Senior Physical Failure Analysis Engineer

NVIDIA is the pioneer of GPU-accelerated computing and the engine powering the global AI revolution.

We build the full-stack AI infrastructure, advanced microelectronics, and hardware ecosystems that drive everything from massive data center AI factories to autonomous vehicles, robotics, and advanced scientific simulation.

Physical Failure Analysis team is relentlessly committed to quality, pushing the boundaries of semiconductor innovation and hardware reliability.

We are seeking a highly skilled and motivated Failure Analysis Engineer to join our world-class Failure Analysis Lab.

In this role, you won’t just solve problems—you will work at the dynamic intersection of physics, process technology, physical design, and circuit design to investigate complex product failures and drive critical engineering solutions.

The Mission: Perform Physical Failure Analysis (PFA) on some of the world’s most advanced integrated circuits, deep learning processors, and system architectures, uncovering root causes that directly shape the future of computing.

We are looking for an adaptable technical expert capable of translating open-ended challenges into actionable insights.

If you excel in fast-paced environments and want to help build the infrastructure defining the modern era, we encourage you to apply.

• Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
• Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
• Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.
• Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.
• Optimize Workflows: Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.