Semiconductor Packaging Engineer

The successful applicant will be responsible for mechanical engineering, including mechanical design, assembly process development and implementation and packaging of infrared focal plane arrays, for visible and infrared sensors

• Work in mechanical and electrical subsystems and integrate them into a larger system
• Perform process related activities, such as process development and yield improvement activities.
• Assemble optoelectronic components of FPAs into final device packaging including die attach, wire bonding, solder, inspect and test
• Perform hands-on work on mechanical and electrical systems and components
• Use hand tools to perform integration and assembly tasks in a laboratory environment
• Set up and operate test equipment to verify, evaluate, and troubleshoot systems and components
• Perform electrical characterization of components and integrated assemblies
• Design fixturing , assembly aids, and support equipment
• Read, understand and utilize engineering documentation including: drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material
• Provide data analysis and status reporting to technical staff and leadership
• Support maintenance of lab instrumentation

• Experience in a laboratory or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs
• Experience with optoelectronic packaging technology and integration techniques
• Understanding and application of basic electrical and mechanical engineering concepts
• Ability to function safely in a laboratory environment performing assembly, integration, test, and troubleshooting tasks
• Ability to follow formal and informal assembly and integration processes