Program Manager (Chip Development)

Summary

Key Responsibilities

• Program Leadership & Strategy:
• Define program scope, objectives, deliverables, and success criteria in collaboration with cross-functional teams (e.g., Architecture, Design, Verification, Physical Design, Software, Test, Product, Operations).
• Develop and maintain comprehensive program plans, schedules, and budgets, including critical path identification and risk mitigation strategies.
• Drive cross-functional alignment and accountability across all phases of the chip development lifecycle, from concept to silicon validation and mass production.
• Act as the primary point of contact for the program, providing regular updates to stakeholders, senior management, and external partners.
• Automotive Standards Compliance & Management:
• Ensure full compliance with ISO 26262 (Functional Safety) throughout the chip development lifecycle, including defining Safety Goals, ASIL decomposition, managing safety requirements, and overseeing safety analyses (e.g., FMEDA, FTA).
• Oversee adherence to ISO/SAE 21434 (Automotive Cybersecurity) , managing cybersecurity risk assessments (TARA), defining cybersecurity goals, and ensuring secure design & verification practices for the IC.
• Drive implementation and adherence to Automotive SPICE (ASPICE) process requirements , ensuring robust software and hardware development processes, traceability, configuration management, and quality assurance.
• Work closely with functional safety and cybersecurity managers to integrate these standards seamlessly into the overall program plan and execution.
• Prepare for and support internal and external audits and assessments related to ISO 26262, ISO/SAE 21434, and ASPICE.
• Customer Relationship Management:
• Serve as the primary technical and program interface to key customers , understanding their needs, expectations, and ensuring their satisfaction throughout the development lifecycle.
• Effectively communicate program status, technical progress, and any potential issues or changes to customers.
• Proactively manage customer expectations and negotiate technical and schedule tradeoffs to achieve mutual success.
• Translate customer requirements into actionable internal development plans and ensure effective feedback loops.
• Execution & Monitoring:
• Lead and motivate diverse technical teams, fostering a collaborative and high-performance environment.
• Track program progress against milestones, identify deviations, and implement corrective actions.
• Proactively identify and manage program risks, dependencies, and issues, escalating as necessary.
• Facilitate effective communication and decision-making across all levels of the organization.
• Manage change requests and ensure proper impact analysis and approval processes are followed.
• Technical Acumen:
• Possess a strong understanding of the complete chip development flow, including RTL design, synthesis, place and route, timing closure, verification methodologies, DFT, analog/mixed-signal integration, packaging, and silicon bring-up.
• Collaborate with technical leads to resolve complex engineering challenges.
• Ensure adherence to design methodologies, quality standards, and industry best practices.
• Stakeholder Management:
• Build and maintain strong relationships with internal teams, external vendors (e.g., foundries, IP providers), and customers.
• Manage expectations and negotiate tradeoffs to achieve program goals.
• Prepare and deliver compelling presentations to various audiences, including executive reviews and technical forums.
• Continuous Improvement:
• Conduct post-mortems and lessons learned sessions to identify areas for process improvement.
• Implement best practices in program management and contribute to the evolution of our development methodologies.

Qualifications

• Education: Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Experience:
• 8+ years of experience in the semiconductor industry, with at least 3-5 years in a dedicated program or project management role for chip development projects.
• Proven track record of successfully leading multiple complex ASIC/SoC development programs from concept to high-volume production.
• Demonstrable experience and strong understanding of ISO 26262, ISO/SAE 21434, and Automotive SPICE (ASPICE) requirements and implementation in semiconductor development.
• Experience with Automotive Safety Integrity Levels (ASILs) and Threat Analysis and Risk Assessment (TARA) processes.
• Strong understanding of semiconductor fabrication processes (e.g., FinFET, FD-SOI) and packaging technologies.
• Experience with various silicon technologies (e.g., CPUs, GPUs, DSPs, AI accelerators, custom ASICs) for automotive applications is a plus.
• Technical Skills:
• Familiarity with industry-standard EDA tools and design flows (e.g., Cadence, Synopsys, Siemens EDA).
• Knowledge of various verification methodologies (e.g., UVM, formal verification).
• Understanding of power management, clocking architectures, and high-speed interfaces.
• Program Management Tools & Skills:
• Proficiency and hands-on expertise with Atlassian tools, specifically Jira for issue tracking, project management, and reporting, and Confluence for documentation, knowledge sharing, and collaboration.
• Strong understanding of program management methodologies (e.g., Agile, Waterfall, Hybrid). PMP or equivalent certification is highly desirable.
• Excellent analytical, problem-solving, and decision-making abilities.

Desired Attributes

What You Can Expect From Ethernovia

Salary Range

• The actual offered base salary will vary depending on factors such as individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $150,000 - $200,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits.