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We are seeking a highly skilled and experienced Process Integration Engineer to join our team.
The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:
• dielectric materials selection and application
• lithography
• wet + dry clean/etch/develop processes
• PVD and electroplating
into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures.
You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow.
You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility.
In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.
About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
We offer smart, innovative services to dozens of clients globally.
By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
We are seeking a highly skilled and experienced Process Integration Engineer to join our team.
The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:
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into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures.
You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow.
You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility.
In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.
Private SKC–Applied Materials joint venture manufacturing glass substrates for semiconductor packaging, AI, and high-performance computing.
Visit company websiteJobs and hiring trendsUSD 100000-150000 yearly
Full-time
Senior Level
Onsite
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