Failure Analysis Engineer

Position: PHYSICAL FAILURE ANALYSIS ENGINEER - Bilingual in Korean

Responsible for performing physical failure analysis of glass substrates.

This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures.

The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

• Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques
• Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features
• Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales
• Analyze images to identify defects, fractures, corrosion, and other anomalies
• Analyze data collected from various analyses to develop comprehensive understanding of failure mechanisms
• Generate detailed reports outlining findings, analysis methodologies, and recommendations
• Utilize spectroscopic methods to identify material compositions and elemental distributions
• Perform mechanical and thermal testing
• Prepare reports and documentation of failure analysis results
• Work with other engineers and scientists to develop and improve the failure analysis process
• Participate in quality control procedures, including instrument calibration and performance check
• Troubleshoot technical issues
• Provide support to the OQA function with analysis results

• Experiences on SEM / FIB equipments (Analysis tools)
• Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)
• Excellent analytical and problem-solving skills to identify root cause of failures
• Strong attention to detail and ability to accurately document findings and observations
• Excellent communication skills and a proven ability to juggle multiple high priority tasks

• Strong knowledge of electronic devices and their failure mechanisms
• Experience with a variety of failure analysis techniques
• Proficiency in microscopy techniques, material analysis, and spectropy
• Strong understanding of material properties, fracture mechanics, and root cause analysis
• Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

• Bachelor’s degree in material science, electrical engineering, or related field

• 3+ years of experience in physical failure analysis in electronic or semiconductor applications
• Experience in a Manufacturing Environment

• $85,000 - $115,000