Principal Advanced Optical Packaging Engineer

Principal Advanced Optical Packaging Engineer Location: Ottawa, Ontario | Type: Full-time

The Opportunity Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity.

This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer.

Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.

• Package & Process Architecture: Translate product requirements into packaging/assembly strategies; define build sequences, inspection points, rework, and test gates; lead DFM/DFA/DFT/DFR reviews; identify risks and drive DOEs/qualification.
• Flip-Chip, Die Attach & Electrical Integration: Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP); define reflow, solder paste, flux, and cleaning approaches; manage warpage, CTE mismatch, and voiding; develop underfill/encapsulation processes; define AOI, X-ray, and cross-section inspection methods.
• Laser Packaging & Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development; work with laser die, lenses, isolators, and couplers; define alignment, attachment, and burn-in/test flows; manage supplier specs for laser components.
• Fiber Attach & Optical I/O: Develop repeatable fiber-array attach processes (single-mode, PM fiber, multi-fiber arrays); define alignment strategy, adhesive/cure processes, and loss-control methods; support automated fiber-attach station development (motion, vision, dispensation, calibration).
• Thermal-Mechanical & Materials: Evaluate thermal paths and manage package stress/warpage/CTE mismatch; select and qualify solders, underfills, adhesives, TIMs, and encapsulants; partner with mechanical/simulation specialists.
• NPI & Manufacturing Transfer: Lead processes from POC through NPI, qualification, and production ramp; define tooling, SOPs, PFMEAs, and control plans; drive root-cause/corrective action; decide what stays in-house vs. transfers to partners