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We are seeking a highly skilled and motivated Dry Process Engineer to join our R&D team.
In this role you will lead development of dry processing capabilities across plasma etch, physical vapor deposition, and plasma-based ablation steps for fabricating advanced packaging interconnect structures.
This role sits at the intersection of thin-film metallization and dielectric patterning, requiring you to steer equipment and process qualification, process recipe development, and integration handoffs with lithography, wet process, and plating teams.
You will be a primary technical owner for vacuum-based unit processes in a hands-on, early-stage R&D environment where design of experiment planning capabilities and rigorous root-cause analysis both matter.
Job Title: R&D Engineer - Dry Process (Plasma Etch /Plasma Ablation/ PVD) Expert for Advanced Packaging applications
About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
We offer smart, innovative services to dozens of clients globally.
By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
We are seeking a highly skilled and motivated Dry Process Engineer to join our R&D team.
In this role you will lead development of dry processing capabilities across plasma etch, physical vapor deposition, and plasma-based ablation steps for fabricating advanced packaging interconnect structures.
This role sits at the intersection of thin-film metallization and dielectric patterning, requiring you to steer equipment and process qualification, process recipe development, and integration handoffs with lithography, wet process, and plating teams.
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Covington, USA
You will be a primary technical owner for vacuum-based unit processes in a hands-on, early-stage R&D environment where design of experiment planning capabilities and rigorous root-cause analysis both matter.
Private SKC–Applied Materials joint venture manufacturing glass substrates for semiconductor packaging, AI, and high-performance computing.
Visit company websiteJobs and hiring trendsUSD 100000-150000 yearly
Full-time
Mid Level
Onsite
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