NPI Process Engineer

• Participate in product roadmap planning: identify technology gaps, define development priorities, and align the NPI pipeline with customer and market requirements.
• Act as the primary technical point of contact for customer engineering teams throughout the product development cycle.
• Lead customer technical meetings: present product development status, DFM feedback, sample evaluation results, and qualification progress.
• Manage the customer sample cycle: coordinate build scheduling, shipment, and follow-up on customer evaluation feedback.
• Drive product launch activities in close coordination with customers — from final qualification sign-off through initial production delivery.

• Define qualification test plans in alignment with customer requirements and product application; coordinate test execution with internal and external test resources.
• Review and interpret reliability test results (HAST, TCT, bending, electrical characterization, etc.); prepare qualification summary reports for customer and internal review.
• Identify reliability risks early in the development cycle through design and process review; drive mitigations before qualification.
• Own qualification documentation and manage handoff to the production team upon successful completion.

• Work closely with process engineering, CAM, and operations teams to resolve development issues and ensure smooth NPI-to-production transitions.
• Collaborate with Korea HQ R&D and engineering on material and technology development aligned with the GCS product roadmap.
• Maintain clear and organized NPI program documentation: product specs, development reports, qualification records, and lessons learned.
• Feed process and product insights back into design rules and development best practices to improve future NPI cycles.

• Bachelor's degree or higher in any engineering discipline — Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or equivalent. Field of study is less important than hands-on engineering experience.

• 3+ years of experience in substrate or semiconductor packaging engineering. We are targeting a mid-level to senior engineer; Junior-level candidates will not be considered. Final level placement will be assessed through the interview process.
• Substrate manufacturer background strongly preferred; OSAT packaging engineering background also well-suited:
• Advanced substrate process experience: buildup layer, via fill, surface finish, panel processing, or equivalent
• OSAT packaging experience: FC-BGA, 2.5D/3D integration, chiplet packaging, or equivalent
• Glass or specialty substrate background (TGV, ceramic, embedded) is a significant plus
• Hands-on process engineering or product analysis experience — someone who has worked with materials and processes directly, not just managed programs from a desk.
• Experience taking a product from development through customer qualification and commercial launch.
• Working understanding of reliability concepts as applied to semiconductor packaging: failure modes, stress testing principles, and how design and process decisions affect long-term product performance.

• Must be 18 years of age or older.
• Must be legally authorized to work in the United States.
• Proficiency in MS Office: Excel, Word, PowerPoint, Outlook.

The following are not required but would strengthen a candidate's application:

• Experience developing or contributing to product roadmaps in collaboration with customers.
• Familiarity with DFM (Design for Manufacturability) concepts for high-density substrates.
• Background in failure analysis: cross-section SEM/TEM, EDX, or equivalent analytical techniques.
• Exposure to quality certification frameworks (ISO 9001, IATF 16949) or reliability test standards — understanding of the framework is sufficient; hands-on ownership not required.
• Experience with DOE or statistical analysis tools (Minitab, JMP) in a process or product development context.
• Automotive-grade product experience or familiarity with AEC-Q100 qualification requirements.
• Korean language proficiency (oral and/or written) — helpful for day-to-day collaboration with Korea HQ engineering teams.
• Strong technical writing and presentation skills; comfortable presenting to both customer engineers and senior leadership.

• $85,000 – $115,000

• 401K 6% matching (NO vesting period)
• Healthcare 100% support (Health, Dental, Vision)
• Life, STD, LTD 100 % support
• Cell phone allowance
• PTO and self-development