Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.
What We Offer
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You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .
Key Responsibilities:
Mechanical architecture: Define and own the mechanical package, including mobile platform integration, robot mounting structure, FOUP load port and enclosure design.
Robot integration & automation: Select robots and end-effectors, run kinematics, reach and payload studies, and resolve hand-off requirements jointly with the tool team.
Docking & levelling: Develop docking and auto-levelling mechanisms, including vibration control through the docking sequence.
Wafer-handling environment: Engineer FFU/ETU airflow enclosures and cleanliness-compliant structures suited to wafer transfer duty.
Analysis (FEA): Run structural, modal, vibration and thermal FEA across chassis, robot mounts and mechanical interfaces, and close out design gaps ahead of build release.
CAD & GD&T: Deliver large-assembly 3D models, GD&T-controlled drawings to ASME Y14.5 and tolerance stack-ups in NX / Inventor / SolidWorks, maintaining full PDM/PLM discipline.
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DFM & source: Drive DFM/DFA and design reviews, own the BOM, and support supplier selection, quotations and long-lead procurement.
Build & qualification: Lead prototype build, assembly and debug, and qualify docking, levelling, battery/charging integration and throughput through to tool deployment.
Wafer handling: Strong working proficiency in wafer-handling environments and their cleanliness requirements.
FEA: Structural, modal, vibration and thermal simulation of frames, mounts and moving assemblies, with design decisions closed out from the results.
GD&T: ASME Y14.5 dimensioning and tolerance stack-up analysis to secure repeatable docking and alignment.
CAD: Ownership of large assemblies in NX / Inventor / SolidWorks, including drawing release and design documentation for procurement.
Strong communication skills, with the ability to lead design reviews and collaborate across global teams.
Qualifications & Experience: B.E./B.Tech or M.E./M.Tech in Mechanical or Mechatronics Engineering 8–12 years of experience across semiconductor capital equipment, robotics or factory automation. Proven ownership of at least one system taken from concept through prototype build to deployment. Effective cross-functional working with electrical, controls/software, safety and tool-integration teams. Preferred to Have SPM domain expertise. Exposure to SEMI S2/S8 safety standards and interlock-aware mechanical design. AGV/AMR deployment experience inside a fab or other high-cleanliness environment. DFMEA, supplier development and cross-site program execution.
Qualifications & Experience:
B.E./B.Tech or M.E./M.Tech in Mechanical or Mechatronics Engineering 8–12 years of experience across semiconductor capital equipment, robotics or factory automation. Proven ownership of at least one system taken from concept through prototype build to deployment. Effective cross-functional working with electrical, controls/software, safety and tool-integration teams. Preferred to Have SPM domain expertise. Exposure to SEMI S2/S8 safety standards and interlock-aware mechanical design. AGV/AMR deployment experience inside a fab or other high-cleanliness environment. DFMEA, supplier development and cross-site program execution.
B.E./B.Tech or M.E./M.Tech in Mechanical or Mechatronics Engineering
8–12 years of experience across semiconductor capital equipment, robotics or factory automation.
Proven ownership of at least one system taken from concept through prototype build to deployment.
Effective cross-functional working with electrical, controls/software, safety and tool-integration teams.
Preferred to Have SPM domain expertise. Exposure to SEMI S2/S8 safety standards and interlock-aware mechanical design. AGV/AMR deployment experience inside a fab or other high-cleanliness environment. DFMEA, supplier development and cross-site program execution.
Preferred to Have
SPM domain expertise. Exposure to SEMI S2/S8 safety standards and interlock-aware mechanical design. AGV/AMR deployment experience inside a fab or other high-cleanliness environment. DFMEA, supplier development and cross-site program execution.
SPM domain expertise.
Exposure to SEMI S2/S8 safety standards and interlock-aware mechanical design.
AGV/AMR deployment experience inside a fab or other high-cleanliness environment.
DFMEA, supplier development and cross-site program execution.
Module Ownership and System Level Thinking
Relocation Eligible
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
About Applied Materials
Semiconductors36500 employeesFounded 1967
Global leader in materials engineering for the semiconductor industry.
