Engineer, Semi Packaging Engineering

Come join Analog Devices (ADI) – a place where Innovation meets Impact.

For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives.

At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge.

ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.

With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible.

Learn more at www.analog.com and on LinkedIn and X.

This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments.

The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost.

Candidates will be expected to:

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.