Director, Package Design Engineering

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
• Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
• Knowledge of wire-bonding & multi-chip module technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

The expected annual pay range for this position is $230,000-260,000.

This position is also eligible for bonus opportunities.

Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier .

With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial.

It shapes how we work, grow and deliver on our purpose together.

This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary.

More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations.

Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons.

The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.