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You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization.
In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly.
Requirements.
This role requires both materials science depth and process integration awareness.
You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.
Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications
About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing.
We offer smart, innovative services to dozens of clients globally.
By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization.
In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly.
Requirements.
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Covington, USA
Covington, USA
Covington, USA
This role requires both materials science depth and process integration awareness.
You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.
Private SKC–Applied Materials joint venture manufacturing glass substrates for semiconductor packaging, AI, and high-performance computing.
Visit company websiteJobs and hiring trendsUSD 100000-150000 yearly
Full-time
Mid Level
Onsite
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