Design for Manufacturing (DFM) Engineer - PCBA

Description

Minimum Qualifications

• BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
• 5+ years of experience in printed circuit assembly manufacturing processes.
• Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
• Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
• Travel domestically and internationally to supplier sites – 60%

Preferred Qualifications

• Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
• Experience with the development and evaluation of various SMT processes
• Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
• Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
• Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences