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Clear filters151 Semiconductor Components Industries, LLC · San Jose
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component a
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Apply151 Semiconductor Components Industries, LLC · Scottsdale
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selecti
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Applyonsemi · San Jose
Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component a
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Applyonsemi · Scottsdale
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selecti
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Applyonsemi · Scottsdale
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selecti
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ApplySiTime Corporation · Santa Clara
About SiTime SiTime is the Precision Timing company. Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems
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Discovered 1 weeks ago
ApplyMicron Technology · Boise
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into in
Skills
Discovered 1 weeks ago
ApplyNokia ·
Are you passionate about pushing the boundaries of optical package design? We're seeking a talented and driven Packaging Development Engineer to lead the development of next-generation packaging solutions. In this role,
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Discovered 1 weeks ago
ApplySkywater · Kissimmee
Position Summary: As an Advanced Packaging Process Engineer, you will own all assigned Process Steps. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to th
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Discovered 1 weeks ago
ApplyNVIDIA · Santa Clara
We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning &
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Discovered 1 weeks ago
ApplyMicron Technology · Boise
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into in
Skills
Discovered 1 weeks ago
ApplyHaus Labs · El Segundo
Job Title: Coordinator, Package Development & Engineering Department: Packaging Manager: Senior Manager, Package Development & Engineering Salary: $75,000-$85,000 Who We Are Haus Labs is next-gen, skincare-infused m
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Discovered 1 weeks ago
ApplyHLB90067 · El Segundo
Job Title: Manager, Package Development & Engineering Department: Packaging Manager: Senior Manager, Package Development & Engineering Salary: $90,000-$100,000 Who We Are Haus Labs is next-gen, skincare-infused make
Skills
Discovered 1 weeks ago
ApplyMicron Technology · Boise
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into in
Skills
Discovered 1 weeks ago
ApplyBroadcom · Irvine
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Discovered 1 weeks ago
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