Training Technicians

Training Technicians

Key Responsibilities

• Deliver practical and theoretical training on IC manufacturing processes such as:
• Wafer handling and preparation
• Die attach, wire bonding, and flip-chip processes
• Encapsulation / molding techniques
• Trimming, forming, and singulation
• Electrical testing, burn-in, and final test
• Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.
• Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.
• Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.
• Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.
• Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.
• Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.
• Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.
• Track trainee performance, attendance, and competency development; maintain training documentation.
• Support internal and external assessors during OSAT certification assessments.
• Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.
• Coordinate with industry partners, assessment bodies, and placement teams when required.

Required Qualifications

• ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.
• OSAT / NSQF / Semiconductor Skill Certification preferred.