greenhouse
Thermo Mechanical Engineer
Fractile
Bristol, GBR
Full-time
Senior · 7+ years experience
Onsite
Discovered 2 weeks ago
Free
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The Role
You will lead the design of an advanced cooling system for a high-density AI accelerator system destined for data centre deployment. This includes developing the full cooling architecture — from Direct-to-Chip (D2C) liquid cooling through to rack-level thermal management and hybrid liquid-air solutions for host chassis. You’ll collaborate closely with mechanical engineers (internal and external), chip and board designers, and 3rd-party suppliers to define requirements, review designs, and ensure that every aspect of the system — from the cold plate up — meets performance, reliability, and manufacturability goals. We expect you to bring a mix of technical authority, practical design sense, and strong supplier management skills. You may also lead or advise on the development of a thermal test platform to validate solutions in real-world conditions.
Key Responsibilities
- Lead the design and specification of an advanced cooling solution for dense AI hardware systems
- Work closely with 3rd-party suppliers to define thermal and mechanical requirements and review proposed solutions
- Contribute to mechanical system design — specifying chassis interfaces, manifold routing, fittings, and integration details
- Model and simulate thermal performance at cold plate, chassis, and rack levels
- Develop and/or oversee a test platform to validate cooling concepts and final implementation
- Support the design of Direct-to-Chip (D2C) liquid cooling systems, Cold Plates, CDUs, and Hybrid Liquid-Air chassis
- Drive design reviews, evaluate trade-offs, and ensure solutions are manufacturable and reliable
- Liaise with system, hardware, and data centre teams to ensure the cooling architecture integrates seamlessly into overall system design
Skills & Experience Essential
- Bachelor's Degree in Mechanical Engineering
- At least 7 years of experience in developing hardware products with thermal design liquid cooling systems for high-performance computing, data centres, or equivalent high-density hardware
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