gem
Substrate Process Engineer
Atomica
Goleta, USA
Full-time
Mid · 3+ years experience
Onsite
USD 90000-140000 yearly / year
Discovered 1 weeks ago
DOESPCCMP
Free
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DOESPCCMP
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DOESPCCMP
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- Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).
- Wet etch processes (Si, oxide, metals) including rate and uniformity control.
- Support electroplating processes (Au, Cu, Ni, NiFe, AuSn).
- Support Dicing, CMP , wafer Grinding processes.
- Improve yield, reduce defects, and optimize process stability.
- Perform DOE, root cause analysis, and SPC monitoring.
- Support equipment qualification and uptime.
- Work closely with R&D, production, and quality teams.
- B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)
- 3+ years experience in semiconductor or MEMS fabrication
- Hands-on experience in at least two of the following: Wafer bonding Wet etching Electroplating CMP or wafer thinning Dicing
- Wafer bonding
- Wet etching
- Electroplating
- CMP or wafer thinning
- Dicing
About Atomica
Semiconductors154 employeesFounded 2000
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