Staff PIC Process Engineer

Responsibilities

• Process Development & Integration
• Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing
• Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
• Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
• Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
• Manufacturing Data & Yield Excellence
• Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
• Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
• Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
• Define and utilize metrology strategies to ensure robust process control
• Fab Execution & Cross‐Functional Collaboration
• Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
• Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
• Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
• Technical Leadership & Impact
• Provide technical leadership within the PIC process development domain
• Contribute to continuous improvement of tools, methods, and best practices
• Mentor junior engineers and support knowledge transfer across the broader team
• Process Development & Integration - Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing - Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers - Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints - Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules Manufacturing Data & Yield Excellence - Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment - Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance - Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues - Define and utilize metrology strategies to ensure robust process control Fab Execution & Cross‐Functional Collaboration - Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers - Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities - Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp Technical Leadership & Impact - Provide technical leadership within the PIC process development domain - Contribute to continuous improvement of tools, methods, and best practices - Mentor junior engineers and support knowledge transfer across the broader team