Sr. Technical Solutions Manager - Process Control & Yield Enhancement Software Solutions – (Advanced Packaging) (E)

• Build trusted relationships with semiconductor manufacturers, OSATs, foundries, and IDM customers.
• Conduct customer visits, executive briefings, and industry presentations to understand evolving market needs.
• Gather Voice of Customer (VoC) insights and translate feedback into actionable product recommendations.
• Represent KLA at industry conferences, technical forums, and customer events.

• Collaborate closely with Product Management, R&D, Applications Engineering, and Sales teams to align business objectives with product strategy.
• Influence roadmap decisions based on customer requirements, competitive intelligence, and market opportunities.
• Support pricing strategies, business planning, forecasting, and lifecycle management activities.
• Drive cross-functional execution for product launches and strategic initiatives.

• Equip global sales teams with tools, training, and technical messaging to effectively position KLA solutions.
• Support strategic account engagements and key customer opportunities.
• Develop competitive positioning and battle cards to strengthen win rates.
• Monitor adoption metrics and deliver insights to leadership regarding market performance.

• Bachelor's degree in Engineering, Computer Science, Physics, Materials Science, Semiconductor Manufacturing, Business, or related field.
• Minimum 10+ years of experience in semiconductor manufacturing, product marketing, product management, applications engineering, yield engineering, process control, or related technical commercial roles.
• Strong understanding of semiconductor manufacturing processes, yield management, process control methodologies, and advanced packaging technologies.
• Experience marketing or supporting software products, analytics platforms, manufacturing solutions, or semiconductor equipment technologies.
• Demonstrated success leading cross-functional initiatives across engineering, sales, marketing, and business teams.
• Excellent communication, presentation, and executive-level storytelling skills.
• Ability to influence without direct authority and drive alignment across global organizations.
• Comfortable engaging with senior customer executives and technical stakeholders.

• Master's degree or PhD in a technical discipline or MBA.
• Direct experience with advanced packaging technologies including chiplets, TSV, hybrid bonding, heterogeneous integration, and high-bandwidth memory (HBM).
• Knowledge of process control software, AI/ML-driven analytics, manufacturing intelligence, or yield management platforms.
• Experience working with semiconductor foundries, OSATs, memory manufacturers, or advanced packaging suppliers.
• Familiarity with semiconductor inspection, metrology, defect review, or process control workflows.
• Global product launch and portfolio management experience.

• Executive Communication
• Cross-Functional Leadership
• Competitive Analysis
• Go-to-Market Strategy

Doctorate (Academic) Degree and related work experience of 3 years; Master's Level Degree and related work experience of 6 years; Bachelor's Level Degree and related work experience of 8 years

Interns are eligible for some of the benefits listed.

Our pay ranges are determined by role, level, and location.

The range displayed reflects the pay for this position in the primary location identified in this posting.

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