Sr. Staff Thermo-Mechanical Engineer

Responsibilities:

• Serve as the technical authority for thermo-mechanical simulation within the packaging organization, setting standards for model fidelity, validation methodology, and documentation practices adopted across the team.
• Identify capability gaps in simulation tooling, characterization methods, or material databases and champion fundamental investigations that strengthen the team's long-term technical foundation.
• Develop finite element stress, warpage, and assembly process models for wafer-level and unit-level photonic packaging, identifying design, process, and material parameters to mitigate failure modes and optimize yield.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and material solutions to improve product mechanical integrity.
• Conduct multi-physics simulations including solder collapse modeling for bump architecture definition and thermal-structural analysis for packaging stress to meet thermal, electrical, and optical requirements.
• Develop analytical or semi-empirical models for quick turn assessments for new product concepts.
• Drive characterization and validation of mechanical designs and electronic assemblies through lab-scale prototyping and vendor-initiated experiments, closing the loop between simulation predictions and physical hardware.
• Develop Python and MATLAB automation frameworks to scale simulation throughput and establish repeatable, high-efficiency modeling workflows.
• Summarize and communicate findings and recommendations with authority to key stakeholders across Lightmatter, suppliers, and customers.
• Write reports and document methodologies that serve as the technical foundation for the packaging team.
• Required Qualifications:
• MS or PhD in Mechanical Engineering, Material Science, or a related engineering field.
• Deep expertise in finite element analysis using commercial tools such as Ansys, Abaqus, or equivalent, with demonstrated ability to develop and validate models for complex multi-material assemblies.
• Hands-on experience with multi-physics simulation including thermal-structural coupling, solder joint fatigue modeling, and warpage analysis.