Sr. Process Engineer

We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA) .

This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations.

The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.

⚙️ Key Responsibilities

• Process Development & Optimization Design, validate, and optimize stencil designs for solder paste application. Develop and maintain reflow soldering profiles , including vapor phase reflow processes , to ensure robust solder joints and minimize defects. Establish and refine wave soldering profiles for through-hole components. Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps. Develop and oversee conformal coating processes to ensure environmental protection and product reliability. Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
• Design, validate, and optimize stencil designs for solder paste application.
• Develop and maintain reflow soldering profiles , including vapor phase reflow processes , to ensure robust solder joints and minimize defects.
• Establish and refine wave soldering profiles for through-hole components.
• Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.
• Develop and oversee conformal coating processes to ensure environmental protection and product reliability.
• Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
• Manufacturing Support Provide technical leadership to production teams in troubleshooting assembly issues. Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection. Drive yield improvement initiatives and root cause analysis for process-related defects. Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness. Support new product introduction (NPI) by developing scalable and repeatable assembly processes.