Sr. Packaging Engineer

• Lead the design and development of manufacturable package assembly drawings in consultation with the MMIC and design engineers to ensure manufacturing and product goals.
• Lead MMIC assembly discussions with internal and external packaging houses.
• Maintain existing package designs and create new package designs including but not limited to laminate, leadframe, overmold and air cavity construction.
• Work with factories to develop new materials systems and packaging platforms.
• Design and optimize tooling and fixturing to facilitate assembly and manufacturing.
• Continuously improve existing manufacturing techniques by researching new epoxies, attachment methods, interconnect methods, etc.
• Perform technical design reviews at various stages of the product development, and modify existing designs to improve performance, quality, manufacturability, production yields, etc.
• Perform thorough peer review of designs to help team minimize defects.
• Maintain accurate and complete documentation and archive design files for all products by working with internal documentation control systems and guidelines.
• Assist in qualification of new contract manufacturers, as well as lead collaboration to improve assembly yields and reduce manufacturing cost.
• Efficiently solve operational and material issues as they arise.
• Assist in FA activities as relates to the manufacturing process during qualification and on customer RMAs.
• Comply with documented departmental and corporate procedures and recommend changes/ improvements to procedures.

The duties, responsibilities and expectations described above are not a comprehensive list and additional tasks may be assigned to the member, within the scope of the position.

• BSME and 7+ years of industry engineering experience, with at least 3 years of semiconductor packaging and/or process development.
• MSME or equivalent preferred.

• Competent in microwave and milli-meter wave packaging, manufacturing and process development.
• Must have strong knowledge of microelectronic chip-and-wire manufacturing methods and techniques, including: wedge bonding, ball bonding, silver epoxy application, expansion coefficient and thermal conductivity of materials, plating, hard and soft substrate materials, printed circuit board manufacturing methods and techniques.
• Must have ability to use 2D and 3D CAD software (e.g. AutoCAD, Draftsight, Inventor, SolidWorks, etc.).
• Business related computer skills including strong working knowledge of Microsoft Office.
• Professional and positive approach, self-motivated, strong in building relationships, team player, dynamic, creative with the ability to work on own initiative.
• Demonstrated strong oral and written communication skills.
• Strong relationship management, strategy development, project management, problem solving and change management skills.
• Manage diverse, simultaneous projects of varying complexities.

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job.

While performing the duties of this job, the employee is regularly required to talk and hear.

The employee frequently is required to stand, walk, sit and use hands to operate a computer keyboard.

The employee is occasionally required to reach with hands and arms.

The employee must occasionally lift and/or move up to 10 pounds.

Specific vision abilities required by this job include close vision, and ability to adjust focus.

Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

• Displays enthusiasm and Passion for their work
• Works to the standard of Uncompromising Quality by meeting or exceeding stated objectives and embracing continuous improvement
• Exercises sound Business Judgement , ensuring that efforts are on track with the Company’s goals
• Operates with the mindset of Customer Obsession – by meeting or exceeding expectations to both internal and external customers
• Takes Accountability by taking ownership and accepting responsibility for their conduct and contributions
• Demonstrates a strong sense of urgency and accomplishes tasks with Speed and attention to detail
• Cooperates, collaborates and contributes to shared goals with a strong sense of Teamwork
• Conducts themselves with Honesty & Integrity and treats all members with Trust & Respect

• Comply, understand, and support corporate safety initiatives to ensure a safe work environment
• Ability and willingness to abide by Company’s Code of Conduct

Disclaimer: The listed qualifications and requirements for each position are intended as guidelines.

Mini-Circuits reserves the right to hire outside of these guidelines at Management’s discretion.

Mini-Circuits is an Equal Opportunity Employer and does not discriminate on the basis of actual or perceived age, race, creed, color, national origin, sexual orientation, military status, sex, disability, predisposing genetic characteristics, marital status, familial status, gender identity, gender dysphoria, pregnancy-related condition, and domestic violence victim status or protected class characteristic, or any other protected characteristic as established by federal or state law.

Disclaimer: The listed qualifications and requirements for each position are intended as guidelines.

Mini-Circuits reserves the right to hire outside of these guidelines at Management’s discretion.

Mini-Circuits is an Equal Opportunity Employer and does not discriminate on the basis of actual or perceived age, race, creed, color, national origin, sexual orientation, military status, sex, disability, predisposing genetic characteristics, marital status, familial status, gender identity, gender dysphoria, pregnancy-related condition, and domestic violence victim status or protected class characteristic, or any other protected characteristic as established by federal or state law.