Senior Process Engineer

SENIOR PROCESS ENGINEER

RESPONSIBILITIES

• Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials
• Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production
• Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing
• Design production processes from the lab bench through proof of concept and production ramp
• Establish process limits and feedback process constraints as design rules to design teams
• Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams
• Act as the technical owner for failure-analysis findings, root cause analysis, and corrective actions
• Push process yields above 99.9% and thermal-cycle reliability for years-long qualification
• Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US