Senior Microelectronics Process Engineer

Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance to optimize yield and reliability before prototypes are built.

Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques.

Customer Interface: Serve as the primary technical liaison for customers during the development phase, translating their requirements into viable manufacturing processes.

Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans.

Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.) to resolve yield excursions or performance issues.

Documentation: Author and approve high-level process assembly documentation and process qualification reports.

Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers, fostering a culture of technical excellence and best practices.

Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.

Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics).

Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering.

Core Competencies: deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non-negotiable.

Material Science: Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes.

Experience specifically within the Photonics/Microelectronics sector.

Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.

Knowledge of Lean Manufacturing and Six Sigma principles.

Impact: Work on cutting-edge technologies that are shaping the future of connectivity.

Location: Based in the heart of Canada’s tech hub in Kanata, ON.

Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization.

The compensation range for this position is $145,000 - $165,000 annually.

This position is for an existing vacancy.

The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.