ashby
Semiconductor Packaging Engineer
Fab2
Austin, USA
Full-time
Senior · 5+ years experience
Onsite
USD 115000-180000 yearly / year
Discovered 1 weeks ago
Free
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As a Packaging Engineer at fab2, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc.
We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.
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About fab2
The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves. We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.
fab2 was founded by Sam Zeloof and Jim Keller . Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.
About the role
As a Packaging Engineer at fab2, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc.
We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.
Responsibilities
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