Program Manager/Engineer | Embedded Processing

Qualifications

• Minimum requirements:
• Masters in Electrical Engineering, ECE, Computer Engineering, Mechanical Engineering or related engineering degree
• 2+ years of engineering experience with project engineering/management experience on highly complex products/projects
• Proven leadership capabilities in leading multifaceted global organizations
• Successful proven track record in indirect management and influence
• Preferred qualifications:
• Ability to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources
• Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp; Programs will be driven out of multiple global locations
• Ability to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites
• Knowledge of device packaging and wafer fabrication process
• Knowledge of reliability requirements and tri-temp characterization methodology using statistical analysis
• Ability to work in a team environment and understand cross-functional team dynamics
• Ability to work with global customers to align project schedules with customers' key milestones
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results
• Minimum requirements: - Masters in Electrical Engineering, ECE, Computer Engineering, Mechanical Engineering or related engineering degree - 2+ years of engineering experience with project engineering/management experience on highly complex products/projects - Proven leadership capabilities in leading multifaceted global organizations - Successful proven track record in indirect management and influence Preferred qualifications: - Ability to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources - Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp; Programs will be driven out of multiple global locations - Ability to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites - Knowledge of device packaging and wafer fabrication process - Knowledge of reliability requirements and tri-temp characterization methodology using statistical analysis - Ability to work in a team environment and understand cross-functional team dynamics - Ability to work with global customers to align project schedules with customers' key milestones - Demonstrated strong analytical and problem solving skills - Strong verbal and written communication skills - Ability to work in teams and collaborate effectively with people in different functions - Strong time management skills that enable on-time project delivery - Demonstrated ability to build strong, influential relationships - Ability to work effectively in a fast-paced and rapidly changing environment - Ability to take the initiative and drive for results