Product & Yield Engineer (Data-focused)

Fractile was founded in 2022 on the bet that, eventually, the world’s most capable AI systems would be limited in their impact by the time taken to produce useful outputs. We bet everything on the logical conclusion: that the only way to truly unlock this latent value, to make speed viable at scale, was to radically re-invent the hardware that we run our frontier AI models on. Ever since, we have been building chips and systems that tackle this problem: how to efficiently generate output at thousands of tokens per second, while handling the complexity and capacity challenges of operating large models at very long contexts.

The workloads that push to the limits of the current frontier are already transformational; it is the technical and economic limits on inference speed that are constraining progress. The defining work of the 21st century will be marked by the engine of inference delivering immense and diffuse chains of intellectual inquiry, in drug discovery, in software engineering, in materials discovery, in any field where progress is driven by deep reasoning and intelligence to resolve complex problems.

Demonstrable experience within the semiconductor industry in Product Engineering, Test Engineering, Yield Engineering, Data Analytics or Quality Engineering, ideally spanning NPI through to high-volume production

Strong experience analysing semiconductor manufacturing and test data to identify trends, correlations, excursions, yield loss mechanisms and opportunities for improvement

Solid experience in as many of the following areas as possible: Wafer fab: analysis of Process Integration, Yield Enhancement, D0 Control, defect reduction and process variation data IC Assembly: Assembly Process or Package Design, 3D IC and wafer stacking, Assembly Quality Control, BOM optimisation and Yield Engineering Fabless Semiconductor: IC Product Qualification, reliability and failure analysis, RMA investigation and production monitoring

Wafer fab: analysis of Process Integration, Yield Enhancement, D0 Control, defect reduction and process variation data

IC Assembly: Assembly Process or Package Design, 3D IC and wafer stacking, Assembly Quality Control, BOM optimisation and Yield Engineering

Fabless Semiconductor: IC Product Qualification, reliability and failure analysis, RMA investigation and production monitoring