Product Design Engineer, FEA

• Lead structural, thermal, and dynamic finite element analysis (FEA) across Hark's hardware portfolio — enclosures, mechanical assemblies, flex systems, and interconnects — from concept through design validation
• Develop simulation models and methodologies that accurately predict real-world performance under drop, vibration, fatigue, thermal cycling, and mechanical load conditions
• Translate FEA findings into actionable design recommendations, collaborating directly with product design engineers to iterate geometry, material selection, and wall thickness before hardware builds
• Own tolerance stack-up analysis and dimensional management for critical assemblies, identifying risk early and driving resolution through design or process changes
• Define and maintain correlation studies between simulation results and physical test data; continuously improve model accuracy based on empirical feedback from reliability and quality teams
• Partner with Industrial Design and Mechanical Engineering to evaluate design trade-offs weight, stiffness, thermal performance, and manufacturing constraints — and quantify those trade-offs analytically
• Support design of experiments (DoE) and design verification (DV) planning, defining simulation-based pass/fail criteria that map to physical test protocols

• 8+ years of FEA and structural simulation experience in a consumer hardware, aerospace, medical device, or precision manufacturing environment
• Expert-level proficiency in at least one major FEA platform (ANSYS, Abaqus, Nastran, or equivalent); experience with meshing, boundary condition definition, nonlinear materials, and contact modeling
• Strong mechanical engineering fundamentals in solid mechanics, materials science, heat transfer, and dynamics — with the ability to sanity-check simulation outputs against first-principles reasoning
• Experience performing and interpreting drop, vibration, fatigue, and thermal analysis for physical products
• Proficiency in 3D CAD (SolidWorks, NX, Creo, or equivalent) and the ability to simplify and prepare geometry for simulation without losing critical structural fidelity
• Demonstrated track record of closing the loop between simulation predictions and physical test results — including model correlation and iterative refinement

• Experience with coupled thermal-structural or fluid-structure interaction (FSI) simulation for compact, thermally constrained consumer electronics
• Familiarity with flexible PCB or overmold assembly mechanics and the simulation challenges they present
• Exposure to acoustic or vibration analysis in wearable or handheld devices
• Experience with topology optimization or generative design methods to guide optimized structural design
• Background in designing or validating components manufactured via injection molding, diecasting, or precision CNC machining

The US base salary range for this full-time position is between $120,000 - $300,000 annually.

The pay offered for this position may vary based on several individual factors, including job-related knowledge, skills, and experience.

The total compensation package may also include additional components/benefits depending on the specific role.

This information will be shared if an employment offer is extended.